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Boron - doped latex source

作者:admin发布时间:2021-06-07 16:46

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Boron - doped latex source (semiconductor chip manufacturing: diffusion doping source) new material


Applications: Diffusion doping sources for semiconductor chips


Introduction to the

Applications: Diffusion doping sources for semiconductor chips.

Applications: Diffusion doping sources for semiconductor chips

Quality effect: the diffusion coefficient of boron-doped latex source new material is relatively concentrated, the wafer junction depth is uniform, the phosphorus flower is fine, the silicon wafer surface is clean, the silicon lattice of uniform thickness is intact, and there is no alloy point.After diffusion, the device surface is clean and dry, which will not damage the silicon surface and is conducive to lithography.


Advantages: simple equipment, few procedures, one step process can be completed diffusion, source concentration can be adjusted in a larger range, the basic non-toxic impurities precipitation, etc., than the current commonly used liquid source, solid source has more advantages, basically non-toxic odorless more environmental protection, than the conventional process is simpler, stable, reliable, safe;At the same time, the diffusion is not affected by airflow. In the same furnace, not only the uniformity of the same large plate is good, but also the uniformity between the plates is good, and the reproducibility of the results is also quite good.


Operation process:

Coating method Coating source: the use of central rotation coater.Start the motor to start the coating machine, so that the silicon wafer adhesive adsorption plate high-speed rotation, speed of about 3000-4000 RPM, the clean silicon wafer on the adhesive adsorption plate, with vacuum adsorption method to absorb the wafer, with a brush the source coated on the silicon wafer, so that the source is full of the whole silicon wafer.Be careful when coating source: shake the source evenly before use

(when not used to use plastic wrap to seal the storage freezer), the source should be evenly covered with the whole surface of the silicon wafer, the source of the glue plate rotation to be stable, not eccentric.The amount of coating source, the rotation speed of the coating plate, the coating time and so on all have an impact on the thickness of the source film.In order to ensure the consistency of product parameters, it is necessary to strictly grasp the conditions of the coating source, if the conditions are available, the operator had better be fixed;The whole TuYuan

The process must be carried out in a purified environment and the relative humidity must be less than 40%.


Precautions for use and storage:


1, away from fire, heat source.The packing must be sealed and protected from moisture.Should be stored separately from flammable, combustible, alkali, etc.Prevent damage to packaging and containers.It is not suitable for transportation in rainy weather.


2. Pour as much as you use.Because the source is volatile, to quickly smear, the original bottle cap cover.


3, boron source should be put in the refrigerator of 2~5 degrees, do not be reliable refrigerator wall.


4. Pay attention to hand protection when using this product: wear anti-poison penetration gloves. 


Shelf life: 60 days


Packing: carton with built-in foam box, 10 bottles per carton (10L), plastic bottle: 1L pure liquid.

 


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